Processors

AMD Opteron Dual-Core 2216 HE. Processor family: AMD Opteron, Processor socket: Socket F (1207), Processor lithography: 90 nm. L1 cache: 0.125 MB

AMD Opteron 4284. Processor family: AMD Opteron, Processor socket: Socket C32, Processor lithography: 32 nm. L1 cache: 0.048 MB

Cisco Intel Xeon E5-2620 v2, Refurbished. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S

AMD Ryzen 7 3700X. Processor family: AMD Ryzen™ 7, Processor socket: Socket AM4, Processor lithography: 7 nm. Memory channels: Dual-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz. Market segment: Desktop, PCI Express configurations: 4x16

Intel Xeon E-2336. Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Use conditions: Server/Enterprise, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4. Intel® Turbo Boost Technology 2.0 frequency: 4.8 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB. Package type: Retail box

Lenovo Xeon Silver 4314. Processor family: Intel Xeon Silver, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Package type: Retail box

Lenovo Intel Xeon E5-2650 v4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1536 GB, Memory types supported by processor: DDR4-SDRAM. Supported instruction sets: AVX 2.0, Scalability: 2S, Physical Address Extension (PAE): 46 bit. Compatibility: HPE DL160 Gen9

Lenovo Intel Xeon E5-2650 v4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1536 GB, Memory types supported by processor: DDR4-SDRAM. Supported instruction sets: AVX 2.0, Scalability: 2S, Physical Address Extension (PAE): 46 bit. Compatibility: HPE DL160 Gen9

Lenovo Intel Xeon Silver 4208. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 2S

Lenovo Intel Xeon Silver 4208. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 2S

Lenovo 4XG7A14812. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: ThinkSystem ST550

Intel Xeon E-2136. Processor family: Intel® Xeon®, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz. Package type: Retail box

Intel Xeon W-2223. Processor family: Intel Xeon W, Processor socket: LGA 2066 (Socket R4), Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Workstation, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 1S. Package width: 1.73" (44 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm). Processor package size: 45mm x 52.5mm

Intel Xeon ® ® E-2336 Processor (12M Cache, 2.90 GHz). Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0,AVX-512. Intel® Turbo Boost Technology 2.0 frequency: 4.8 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB. Package type: Retail box

Intel Xeon E-2236. Processor family: Intel Xeon E, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.8 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

Intel Xeon E-2136. Processor family: Intel® Xeon®, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

Intel Xeon E5-2609V4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1536 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S. Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 45mm x 52.5mm

Intel Xeon E3-1268LV5. Processor family: Intel® Xeon® E3 v5, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM,DDR3L-SDRAM. On-board graphics adapter model: Intel® HD Graphics P530, Maximum on-board graphics adapter memory: 64 GB, On-board graphics adapter outputs supported: Embedded DisplayPort (eDP),DisplayPort,HDMI,DVI. Market segment: Embedded, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.4 GHz