Processors

Intel Xeon Silver 4410T. Processor family: Intel Xeon Silver, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Use conditions: Industrial Commercial Temp, Server/Enterprise, Supported instruction sets: AMX, SSE4.2, AVX, AVX 2.0, AVX-512. Maximum Enclave Size Support for Intel® SGX: 64 GB, Intel® Data Streaming Accelerator (DSA): 1 default devices. Processor package size: 77.5 x 56.5 mm

Intel Xeon Silver 4310T. Processor family: Intel Xeon Silver, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Processor package size: 77.5 x 56.5 mm

Intel Xeon W-10885M. Processor family: Intel Xeon W, Processor socket: FCBGA1440, Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel® UHD Graphics, On-board graphics card outputs supported: Embedded DisplayPort (eDP),DisplayPort,HDMI,DVI, On-board graphics card base frequency: 350 MHz. Market segment: Mobile, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Intel® Turbo Boost Max Technology 3.0 frequency: 5.1 GHz, Intel® Thermal Velocity Boost Frequency: 5.3 GHz

Lenovo Intel Xeon Gold 5118. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Supported instruction sets: AVX,AVX 2.0,AVX-512,SSE4.2, Scalability: S4S. Processor package size: 76.0 x 56.5 mm

Lenovo Intel Xeon Gold 5118. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Supported instruction sets: AVX,AVX 2.0,AVX-512,SSE4.2, Scalability: S4S. Processor package size: 76.0 x 56.5 mm

Intel Core ® ™ i5-12600KF Processor (20M Cache, up to 4.90 GHz). Processor family: Intel® Core™ i5, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM,DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express configurations: 1x16+1x4,2x8+1x4. Package type: Retail box. Processor package size: 45 x 37.5 mm

Lenovo Intel Xeon E5-2650 v4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1536 GB, Memory types supported by processor: DDR4-SDRAM. Supported instruction sets: AVX 2.0, Scalability: 2S, Physical Address Extension (PAE): 46 bit. Compatibility: HPE DL160 Gen9

Lenovo Intel Xeon E5-2650 v4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1536 GB, Memory types supported by processor: DDR4-SDRAM. Supported instruction sets: AVX 2.0, Scalability: 2S, Physical Address Extension (PAE): 46 bit. Compatibility: HPE DL160 Gen9

Lenovo Intel Xeon E5-2650 v4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1536 GB, Memory types supported by processor: DDR4-SDRAM. Supported instruction sets: AVX 2.0, Scalability: 2S, Physical Address Extension (PAE): 46 bit. Compatibility: HPE DL160 Gen9

Lenovo Intel Xeon Gold 5118. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Scalability: S4S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SR650

Lenovo Xeon Gold 6326. Processor family: Intel® Xeon® Gold, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Lenovo EPYC AMD 7413. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor manufacturer: AMD. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz. Market segment: Server

Intel Xeon W-2235. Processor family: Intel Xeon W, Processor socket: LGA 2066 (Socket R4), Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Workstation, PCI Express configurations: 1x4,1x8,1x16, Supported instruction sets: SSE4.2,AVX,AVX 2.0,AVX-512. Package width: 1.73" (44 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm). Processor package size: 45mm x 52.5mm

AMD Ryzen 9 7900X3D. Processor family: AMD Ryzen™ 9, Processor socket: Socket AM5, Processor lithography: 5 nm. Memory channels: Dual-channel, Memory types supported by processor: DDR5-SDRAM, Memory clock speeds supported by processor: 3600,5200 MHz. On-board graphics card model: AMD Radeon Graphics, On-board graphics card base frequency: 2200 MHz. Market segment: Desktop

Intel Xeon ® ® E-2388G Processor (16M Cache, 3.20 GHz). Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel UHD Graphics P750, Maximum on-board graphics card memory: 64 GB, On-board graphics card base frequency: 350 MHz. Market segment: Server, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0,AVX-512. Intel® Turbo Boost Technology 2.0 frequency: 5.1 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB

Intel Core ® ™ i5-12600KF Processor (20M Cache, up to 4.90 GHz). Processor family: Intel® Core™ i5, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM,DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express configurations: 1x16+1x4,2x8+1x4. Package type: Retail box. Processor package size: 45 x 37.5 mm

Lenovo AMD EPYC 7272. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor lithography: 7 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz

Cisco Intel Xeon E5-2623 v3. Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Processor package size: 52.5 mm