Kingston Technology KSM26RD4/32HDI memory module 32 GB 1 x 32 GB DDR4 2666 MHz ECC

Kingston Technology KSM26RD4/32HDI. Component for: PC/server, Internal memory: 32 GB, Memory layout (modules x size): 1 x 32 GB, Internal memory type: DDR4, Memory clock speed: 2666 MHz, Memory form factor: 288-pin DIMM, CAS latency: 19, ECC
Manufacturer: Kingston Technology
Availability: Out of Stock - on backorder and will be dispatched once in stock.
SKU: 5866343
Manufacturer part number: KSM26RD4/32HDI
MSRP: $191.00
$147.49
Kingston's KSM26RD4/32HDI is a 4G x 72-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM) registered w/ parity, 2Rx4, ECC, memory module, based on thirty-six 2G x 4-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
  • 16 internal banks
  • Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available
  • Bi-Directional Differential Data Strobe
  • 8 bit pre-fetch
  • Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
  • Supports ECC error correction and detection
  • On-Die Termination (ODT)
  • Temperature sensor with integrated SPD
  • This product is in compliance with the RoHS directive
  • Per DRAM Addressability is supported
  • Internal Vref DQ level generation is available
  • Write CRC is supported at all speed grades
  • CA parity (Command/Address Parity) mode is supported
Kingston's KSM26RD4/32HDI is a 4G x 72-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM) registered w/ parity, 2Rx4, ECC, memory module, based on thirty-six 2G x 4-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
  • 16 internal banks
  • Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available
  • Bi-Directional Differential Data Strobe
  • 8 bit pre-fetch
  • Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
  • Supports ECC error correction and detection
  • On-Die Termination (ODT)
  • Temperature sensor with integrated SPD
  • This product is in compliance with the RoHS directive
  • Per DRAM Addressability is supported
  • Internal Vref DQ level generation is available
  • Write CRC is supported at all speed grades
  • CA parity (Command/Address Parity) mode is supported
Products specifications
Attribute nameAttribute value
Row cycle time46.25 ns
Refresh row cycle time350 ns