Kingston Technology KF316C10BK2/16 memory module 16 GB 2 x 8 GB DDR3 1600 MHz

Kingston Technology KF316C10BK2/16. Component for: PC/server, Internal memory: 16 GB, Memory layout (modules x size): 2 x 8 GB, Internal memory type: DDR3, Memory clock speed: 1600 MHz, Memory form factor: 240-pin DIMM, CAS latency: 10

Manufacturer: Kingston Technology

SKU: 6316353

Manufacturer part number: KF316C10BK2/16

$84.00

Qty:

FURY KF316C10BK2/16 is a kit of two 1G x 64-bit (8GB) DDR3-1600 CL10 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 512M x 8-bit FBGA components per module. Total kit capacity is 16GB. Each module has been tested to run at DDR3-1600 at a low latency timing of 10-10-10 at 1.5V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. Each 240-pin DIMM uses gold contact fingers.

JEDEC standard 1.5V Power Supply
VDDQ = 1.5V
800MHz fCK for 1600Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 11, 10, 9, 8, 7, 6
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C 3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
Height 1.338” (34mm) w/heatsink

JEDEC standard 1.5V Power Supply
VDDQ = 1.5V
800MHz fCK for 1600Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 11, 10, 9, 8, 7, 6
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C 3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
Height 1.338” (34mm) w/heatsink