- Up to 1.25Gb/s bi-directional data links - Hot-pluggable SFP footprint - Extended case temperature range (-40°C to +85°C) - Fully metallic enclosure for low EMI - Low power dissipation (1.05 W typical) - Compact RJ-45 connector assembly - Access to physical layer IC via 2-wire serial bus - 10/100/1000 BASE-T operation in host systems with SGMII interface