- Up to 1.25Gb/s bi-directional data links
- Hot-pluggable SFP footprint
- Extended case temperature range (-40°C to +85°C)
- Fully metallic enclosure for low EMI
- Low power dissipation (1.05 W typical)
- Compact RJ-45 connector assembly
- Access to physical layer IC via 2-wire serial bus
- 10/100/1000 BASE-T operation in host systems with SGMII interface