| Country of Origin | China, Taiwan |
| Width | 0.15" |
| Depth | 2.74" |
| Height | 1.18" |
| Weight | 0.627 oz |
| JEDEC standard | Yes |
| Lead plating | Gold |
| Master (outer) case weight | 2.82 lbs |
| Master (outer) case length | 12.3" |
| Master (outer) case width | 8" |
| Master (outer) case height | 4" |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Programming power voltage (VPP) | 1.8 V |
| SPD voltage | 1.1 V |
| SPD speed | 4800 MHz |
| Memory data transfer rate | 6400 MT/s |
| On-Die ECC | Yes |
| SPD latency | 39 |
| Product color | Black |
| Package width | 3.75" |
| Package depth | 0.551" |
| Package height | 6.75" |
| Package weight | 1.51 oz |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Internal memory | 32 GB |
| Internal memory type | DDR5 |
| Memory clock speed | 3200 MHz |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| CAS latency | 38 |
| Memory voltage | 1.35 V |
| Cooling type | Heatsink |
| Memory layout (modules x size) | 2 x 16 GB |
| Memory ranking | 1 |
| Memory channels | Dual-channel |
| Module configuration | 2048M x 64 |
| Quantity per master (outer) case | 25 pc(s) |