Country of Origin | China, Taiwan |
Width | 0.26" |
Depth | 5.25" |
Height | 1.37" |
Weight | 5.44 oz |
JEDEC standard | Yes |
Master (outer) case weight | 4.92 lbs |
Master (outer) case length | 12.3" |
Master (outer) case width | 8" |
Master (outer) case height | 4" |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Programming power voltage (VPP) | 1.8 V |
SPD voltage | 1.1 V |
SPD speed | 4800 MHz |
Memory data transfer rate | 5200 MT/s |
On-Die ECC | Yes |
SPD latency | 39 |
Product color | White |
Package width | 3.75" |
Package depth | 1" |
Package height | 6.75" |
Package weight | 7.12 oz |
Package type | Blister |
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Internal memory | 64 GB |
Internal memory type | DDR5 |
Component for | PC |
Memory form factor | 288-pin DIMM |
ECC | No |
Buffered memory type | Unregistered (unbuffered) |
CAS latency | 40 |
Memory voltage | 1.25 V |
Cooling type | Heatsink |
Memory layout (modules x size) | 4 x 16 GB |
Memory ranking | 1 |
Memory channels | Quad-channel |
Module configuration | 2048M x 64 |
Quantity per master (outer) case | 10 pc(s) |