| Country of Origin | China, Taiwan |
| Width | 0.319" |
| Depth | 5.24" |
| Height | 1.69" |
| Weight | 14.9 oz |
| JEDEC standard | Yes |
| Backlight | No |
| Lead plating | Gold |
| Master (outer) case weight | 4.54 lbs |
| Master (outer) case length | 10" |
| Master (outer) case width | 7.5" |
| Master (outer) case height | 7" |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Programming power voltage (VPP) | 2.5 V |
| Memory data transfer rate | 3200 MT/s |
| On-Die ECC | No |
| Package width | 4.81" |
| Package depth | 2.9" |
| Package height | 6.75" |
| Package weight | 22.1 oz |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Internal memory | 256 GB |
| Internal memory type | DDR4 |
| Component for | PC/server |
| Memory form factor | 288-pin DIMM |
| ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Cooling type | Heatsink |
| Memory layout (modules x size) | 8 x 32 GB |
| Memory ranking | 2 |
| Module configuration | 4096M x 64 |
| Quantity per master (outer) case | 3 pc(s) |