| Country of Origin | China, Taiwan |
| Width | 1.73" |
| Depth | 5.25" |
| Height | 0.302" |
| Weight | 1.99 oz |
| JEDEC standard | Yes |
| Backlight | Yes |
| Backlight color | Red/Green/Blue |
| Lead plating | Gold |
| Master (outer) case weight | 3.99 lbs |
| Master (outer) case length | 10" |
| Master (outer) case width | 7.5" |
| Master (outer) case height | 7" |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Programming power voltage (VPP) | 1.8 V |
| Memory data transfer rate | 7200 MT/s |
| On-Die ECC | Yes |
| Package width | 4.81" |
| Package depth | 0.681" |
| Package height | 6.75" |
| Package weight | 3.84 oz |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Internal memory | 24 GB |
| Internal memory type | DDR5 |
| Component for | PC/server |
| Memory form factor | 288-pin DIMM |
| ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| CAS latency | 38 |
| Memory voltage | 1.45 V |
| Cooling type | Heatsink |
| Memory layout (modules x size) | 1 x 24 GB |
| Memory ranking | 1 |
| Module configuration | 3072M x 64 |
| Quantity per master (outer) case | 15 pc(s) |